Manufacturer Model Description Plate Diameter Plate Thickness Water Cooled Lap Plate Number of Conditioning Rings Ring Inside Diameter Plate Speed Variable Plate Speed Plate Drive Wafer Size Range Minimum
| Wafer Size Range Maximum Wafer Size Range Set Size Slurry System Slurry Tank Capacity Slurry Recirculating Pump Pneumatic Pressure Arms Adjustable Work Table Operating Air Pressure Air Consumption Accessories Other Information Extended Description
| Power Requirements Voltage Power Requirements Amps Power Requirements Amps 2 Power Requirements Frequency Power Requirements Phase CE Marked Year of Manufacture Condition Exterior Dimensions Width Exterior Dimensions Depth Exterior Dimensions Height Weight
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